The **ATS-13B-29-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 7.57°C/W (Natural Convection) | | **Fin Style** | Straight Fin | | **Spring Type** | Compression Spring | --- ### 2. Breakdown of the Part Number The part number can be decoded as follows to understand the electronic application: * **ATS-13**: Refers to the specific series and hole pattern for the push-pin mounting. * **B**: Denotes the specific package type or revision. * **29**: Indicates the height (approximately 20mm - 25mm range depending on the base). * **C2**: Refers to the material and finish (Blue Anodized Aluminum). * **R0**: Indicates the version or packaging quantity (Standard Retail/Bulk). --- ### 3. Electronic Functionality While a heatsink is a passive mechanical part, it is critical for the reliability of electronic circuits. #### Thermal Management The core purpose is to increase the surface area of a heat-generating semiconductor. By dissipating heat into the ambient air, it prevents **Thermal Throttling** or permanent damage to the silicon die. #### The Interface (TIM) The "C2" variant typically comes with a pre-applied **Thermal Interface Material (TIM)** or is designed to work with specific thermal pads. This fills the microscopic air gaps between the component (e.g., a BGA chip) and the aluminum base to maximize heat transfer. #### Mounting System The push-pin system uses a spring-loaded mechanism. This ensures: 1. **Constant Pressure:** Maintains a consistent force against the chip for optimal thermal contact. 2. **Vibration Resistance:** Prevents the heatsink from shifting during transport or operation. --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and routers. * **Power Electronics:** Voltage regulators and power converters. * **Telecommunications:** Cooling of ASICs and FPGA chips on PCBs. ---