The **ATS-13B-31-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. General Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 25.25°C/W (Unducted Flow @ 100 LFM) | ### 2. Physical Dimensions This part is designed for small to medium-sized chips requiring vertical cooling space. * **Length:** 54.00 mm * **Width:** 54.00 mm * **Height:** 10.00 mm (Low Profile) * **Fin Pitch:** Fine Pattern (for high surface area) ### 3. Electronic Design Features #### A. pushPIN™ Attachment System The part uses a specialized "pushPIN" system which consists of a spring-loaded pin. This is critical for electronics for two reasons: 1. **Constant Pressure:** It ensures even pressure across the surface of the processor or MOSFET, improving thermal transfer. 2. **Vibration Resistance:** The spring mechanism prevents the heatsink from shifting during mechanical shock or vibration. #### B. Thermal Interface Material (TIM) The "R0" suffix indicates that the part typically comes with **pre-applied phase-change material** or a high-performance thermal pad (specifically **T766** in this series). This eliminates the need for manual application of thermal paste. #### C. Material & Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Not just for aesthetics; the anodization process increases emissivity and provides a layer of electrical insulation/corrosion resistance. --- ### 4. Performance Metrics Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 25.25 | | 300 (1.5 m/s) | 6.01 | | 500 (2.5 m/s) | 3.51 | | 700 (3.5 m/s) | 2.53 | --- ### 5. Common Applications * **Networking Hardware:** Cooling CPUs in routers and switches. * **Power Electronics:** Dissipating heat from high-power transistors. * **Embedded Systems:** Industrial PCs where vertical clearance is limited (10mm height).