The **ATS-13B-32-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed to optimize airflow and cooling for electronic components like BGAs, CPUs, and GPUs. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 57mm x 57mm x 15mm | | **Thermal Resistance** | 2.14°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Pressure Spring** | Brass, Nickel Plated | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Characteristics This heat sink features several engineering design choices that improve its efficiency: * **maxiFLOW™ Fin Pattern:** The fin structure is designed to increase surface area and enhance the cooling performance of the air flowing through the sink. * **pushPIN™ Attachment:** This mechanism provides a secure and easy way to mount the heat sink to a PCB. It uses a spring-loaded pin that passes through pre-drilled holes, ensuring consistent pressure on the component. * **Low Profile:** With a height of 15mm, it is suitable for applications where vertical space is limited, such as in 1U servers or compact networking hardware. --- ### 3. Thermal Performance Table The efficiency of the heat sink varies depending on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 2.14 | | 300 (1.5 m/s) | 1.17 | | 400 (2.0 m/s) | 0.89 | | 500 (2.5 m/s) | 0.74 | --- ### 4. Part Number Breakdown The suffix of the part number provides specific manufacturing details: * **C2:** Refers to the Blue Anodized finish. * **R0:** Refers to the revision and packaging standards (usually RoHS compliant).