The **ATS-13B-36-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for secure and efficient cooling of electronic integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 35mm x 35mm | | **Height** | 15mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design Components #### A. The Heat Sink Body The body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The **Straight Fin** design is optimized for environments with high-velocity airflow (forced convection), allowing air to flow through the channels to dissipate heat efficiently. #### B. The Push-Pin Mounting System Instead of using messy thermal adhesives or fragile clips, this part uses a **Brass Push-Pin** mechanism: * **Reliability:** Provides a consistent "clamping force" against the chip. * **Security:** Prevents the heat sink from shifting during vibration or mechanical shock. * **Compatibility:** Requires two pre-drilled holes on the PCB (printed circuit board). #### C. Thermal Interface Material (TIM) The base comes with **T766** pre-applied. This is a phase-change or high-performance thermal grease that fills microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance. --- ### 3. Thermal Performance Profile Thermal resistance is measured in °C/W (Degrees Celsius per Watt). The performance of this part improves as airflow increases: * **@ 200 LFM (Linear Feet per Minute):** ~5.72 °C/W * **@ 500 LFM:** ~3.02 °C/W * **@ 800 LFM:** ~2.10 °C/W --- ### 4. Application Use Cases * **Networking Hardware:** Cooling high-speed switches and routers. * **Embedded Systems:** Protecting processors in industrial computers. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **FPGA Cooling:** Ensuring stability in high-logic-density programmable chips.