Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-13B-41-C3-R0

  • AI
    The **ATS-13B-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips, CPUs, or GPUs to prevent overheating. --- ## 🛠️ Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-13B-41-C3-R0 | | **Heat Sink Type** | pushPIN™ Heat Sink | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 10.07°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight Fin | --- ## 🧩 Key Electronic & Mechanical Components ### 1. The Heat Sink Body (Thermal Mass) Constructed from **6063 Aluminum**, the body features a high-density fin structure. The "Straight Fin" design allows for maximum surface area, which facilitates efficient heat transfer from the component to the surrounding air. ### 2. pushPIN™ Attachment System Instead of using messy thermal adhesives or tapes, this part uses a mechanical **pushPIN™** system. - **Springs:** Ensure constant, uniform pressure across the electronic chip to minimize air gaps. - **Hardware:** Usually includes brass or plastic pins that lock into the PCB (Printed Circuit Board) holes. ### 3. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that the heat sink comes with a **pre-applied Thermal Interface Material**. This is a critical layer that fills microscopic air gaps between the heat sink and the electronic chip, significantly lowering thermal resistance. ### 4. Blue Anodized Finish The surface is treated with a blue anodized coating. While aesthetic, it also provides: - **Corrosion resistance.** - **Improved emissivity**, which slightly aids in radiative heat transfer. --- ## 📈 Performance Characteristics The efficiency of this part is measured by its **Thermal Resistance**. Lower values are better. * **At 100 LFM (Linear Feet per Minute):** 10.07 °C/W * **At 500 LFM:** 2.13 °C/W * **At 700 LFM:** 1.68 °C/W *Note: This shows that the part is highly dependent on airflow (forced convection) to achieve its peak cooling potential.* ---
    ✨ Follow-up Questions
    • ⤷What is the difference between pushPIN and adhesive mounting for this heat sink?
    • ⤷ How do I calculate if the 10.07°C/W thermal resistance is sufficient for my chip?
    • ⤷ Are there alternative fin designs for the ATS-13B series?