AI

The **ATS-13B-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips, CPUs, or GPUs to prevent overheating.
---
## 🛠️ Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Part Number** | ATS-13B-41-C3-R0 |
| **Heat Sink Type** | pushPIN™ Heat Sink |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 40mm x 40mm x 25mm |
| **Thermal Resistance** | 10.07°C/W (Unducted Flow @ 100 LFM) |
| **Fin Style** | Straight Fin |
---
## 🧩 Key Electronic & Mechanical Components
### 1. The Heat Sink Body (Thermal Mass)
Constructed from **6063 Aluminum**, the body features a high-density fin structure. The "Straight Fin" design allows for maximum surface area, which facilitates efficient heat transfer from the component to the surrounding air.
### 2. pushPIN™ Attachment System
Instead of using messy thermal adhesives or tapes, this part uses a mechanical **pushPIN™** system.
- **Springs:** Ensure constant, uniform pressure across the electronic chip to minimize air gaps.
- **Hardware:** Usually includes brass or plastic pins that lock into the PCB (Printed Circuit Board) holes.
### 3. Thermal Interface Material (TIM)
The "R0" at the end of the part number typically indicates that the heat sink comes with a **pre-applied Thermal Interface Material**. This is a critical layer that fills microscopic air gaps between the heat sink and the electronic chip, significantly lowering thermal resistance.
### 4. Blue Anodized Finish
The surface is treated with a blue anodized coating. While aesthetic, it also provides:
- **Corrosion resistance.**
- **Improved emissivity**, which slightly aids in radiative heat transfer.
---
## 📈 Performance Characteristics
The efficiency of this part is measured by its **Thermal Resistance**. Lower values are better.
* **At 100 LFM (Linear Feet per Minute):** 10.07 °C/W
* **At 500 LFM:** 2.13 °C/W
* **At 700 LFM:** 1.68 °C/W
*Note: This shows that the part is highly dependent on airflow (forced convection) to achieve its peak cooling potential.*
---
- ⤷What is the difference between pushPIN and adhesive mounting for this heat sink?
- ⤷ How do I calculate if the 10.07°C/W thermal resistance is sufficient for my chip?
- ⤷ Are there alternative fin designs for the ATS-13B series?