The **ATS-13B-54-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their "maxiFLOW™" product line, designed to optimize airflow and increase surface area for cooling semiconductors. --- ### 1. Technical Specifications Below are the primary technical attributes of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Product Type** | Heat Sink | | **Part Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 6.70°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 35mm | | **Base Shape** | Square | --- ### 2. Key Electronic Components & Design Features #### A. Thermal Interface Material (TIM) The "C2" suffix in the part number indicates the type of Thermal Interface Material applied to the base. * **T766:** This model typically comes pre-applied with high-performance T766 phase-change material or thermal grease to ensure maximum heat transfer between the electronic component (like a BGA chip) and the aluminum base. #### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical **pushPIN™** system. * **Hardware:** It includes a brass or plastic pin with a high-performance compression spring. * **Reliability:** This ensures a consistent pressure (clamping force) on the electronic package, which is critical for long-term thermal stability in high-vibration environments. #### C. Fin Geometry (maxiFLOW™) The "54" in the part number refers to the specific fin pattern. The maxiFLOW design features a **flared fin structure**. This geometry: 1. Reduces pressure drop across the heat sink. 2. Increases the effective surface area compared to standard straight-fin designs. 3. Improves cooling efficiency in systems where airflow is limited or constrained. --- ### 3. Application Use Cases This part is typically used to cool small-form-factor electronic devices, including: * **Field Programmable Gate Arrays (FPGAs)** * **Application-Specific Integrated Circuits (ASICs)** * **Network Switches and Routers** * **High-speed Microprocessors** --- ### 4. Part Number Breakdown ```text ATS - 13 B - 54 - C2 - R0 | | | | | | | | | | | +-- Revision/RoHS status | | | | +------- Thermal Interface Material (T766) | | | +------------ Fin Pattern/Geometry code | | +----------------- Attachment Type (pushPIN) | +-------------------- Size/Series code +-------------------------- Manufacturer (Advanced Thermal Solutions) ```