The **ATS-13B-66-C2-R0** is a high-performance electronic component specifically designed for thermal management. It is a **heat sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications, construction, and technical characteristics. --- ## 1. Technical Specifications The part belongs to the **maxiFLOW™** series, known for its unique fin geometry that maximizes airflow and cooling efficiency. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Base Part Number** | ATS-13B-66-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 40mm x 35mm | | **Thermal Resistance** | 5.77°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (High Performance) | --- ## 2. Key Design Features ### A. Fin Geometry (maxiFLOW™) The "B" in the part number denotes a specific fin configuration. Unlike standard straight fins, this model features a **flared fin design**. This increases the surface area for heat dissipation while reducing the pressure drop, allowing air to move more freely through the sink. ### B. pushPIN™ Attachment Instead of using messy adhesives or weak thermal tape, this part uses a **pushPIN™** system: * **Spring-loaded mechanism:** Ensures consistent pressure across the surface of the processor/chip. * **Reliability:** Resistant to shock and vibration, making it ideal for industrial or transport-related electronics. * **Brass Hardware:** High-quality pins ensure longevity and ease of installation on a PCB. ### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a high-performance thermal grease or pad that fills microscopic air gaps between the heat source (CPU/GPU/FPGA) and the aluminum base, ensuring efficient heat transfer. --- ## 3. Typical Applications This component is generally used to cool high-heat-generating surface-mount devices (SMDs) in the following sectors: * **Telecommunications:** Network switches and routers. * **Embedded Computing:** High-speed processors and FPGA boards. * **Power Electronics:** Power supplies and motor controllers. * **Server/Storage:** Data center hardware requiring robust airflow cooling. --- ## 4. Ordering Nomenclature Breakdown * **ATS:** Advanced Thermal Solutions (Brand) * **13:** Series/Family * **B:** Fin Style (maxiFLOW) * **66:** Dimensional code * **C2:** Material/Finish (Blue Anodized Aluminum) * **R0:** Revision/Packaging status