The **ATS-13B-67-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is specifically designed to provide high thermal performance in environments with constrained airflow. --- ### 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-13B-67-C2-R0 | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.03°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) | --- ### 2. Physical Design and Construction The design of the ATS-13B-67-C2-R0 focuses on maximizing surface area and improving air intake: * **maxiFLOW™ Fin Pattern:** Features a flared fin geometry. This design increases the surface area for heat dissipation while reducing the pressure drop, allowing air to flow through the fins more efficiently. * **pushPIN™ Attachment:** It uses a spring-loaded mechanism that ensures a consistent and secure pressure against the electronic component (CPU, GPU, or FPGA), which is critical for maximizing thermal transfer. * **Material:** Made of high-grade aluminum, which offers a balance between lightweight construction and high thermal conductivity. --- ### 3. Electronic Application Use Cases This heat sink is typically used for cooling high-power semiconductors in various industrial and commercial electronics: 1. **Telecommunications:** Cooling networking chips, routers, and switches. 2. **Embedded Systems:** High-performance single-board computers (SBCs) where vertical space is limited (10mm height). 3. **Power Electronics:** Dissipating heat from MOSFETs, IGBTs, or Voltage Regulator Modules (VRMs). ### 4. Thermal Performance Comparison The effectiveness of this heat sink depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 2.03 | | 400 | 1.15 | | 600 | 0.90 | --- ### Summary Checklist * **Low Profile:** Only 10mm high, ideal for 1U rackmount chassis. * **Secure:** pushPIN™ avoids the "sliding" common with adhesive tapes. * **Ready-to-use:** Comes with pre-applied thermal interface material (TIM).