The **ATS-13B-68-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, known for its low-profile design and high efficiency in forced-air environments. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 1.53°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Attachment Hardware** | Brass, Plastic, or Stainless Steel options | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Components #### A. The Fin Geometry (maxiFLOW™) The "B" in the part number indicates a specific fin pattern. The maxiFLOW™ design features a **spread fin structure**, which reduces pressure drop and increases surface area. This is ideal for cooling high-power electronic components like CPUs, GPUs, or FPGAs in tight spaces. #### B. pushPIN™ Attachment System This part uses a specific mounting mechanism rather than adhesive: * **Compression Springs:** Provides precise pressure to ensure the heatsink stays in contact with the component. * **Plastic/Brass Pins:** Inserted into pre-drilled holes on the PCB for a secure, vibration-resistant fit. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance thermal pad/grease that fills microscopic air gaps between the chip and the heatsink, ensuring maximum heat transfer. --- ### 3. Part Number Breakdown (Nomenclature) To understand exactly what you are ordering, here is how the code is structured: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **13B** | Family/Series (pushPIN™ / maxiFLOW™) | | **68** | Specific Physical Configuration/Size | | **C2** | Thermal Performance Level / Material Grade | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Applications * **Telecommunications:** Cooling of high-speed networking switches. * **Industrial Power:** Heat dissipation for power modules and converters. * **Embedded Systems:** Thermal management for compact PCBA designs where airflow is present.