The **ATS-13B-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** series, designed for secure and efficient attachment to Printed Circuit Boards (PCBs). | Feature | Specification | | :--- | :--- | | **Product Category** | Heat Sink | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Heat Sink Type** | Straight Fin (Square) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.15 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | --- ### 2. Key Component Features #### A. Thermal Performance This heat sink is designed for **forced air cooling**. It uses a "Straight Fin" geometry which is ideal for systems where the airflow direction is consistent. The thermal resistance drops significantly as the Airflow (LFM - Linear Feet per Minute) increases. #### B. The pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part uses the **pushPIN™** mechanism: * **Spring-loaded:** Ensures even pressure across the surface of the electronic component (CPU, GPU, or ASIC). * **Reliability:** Provides a secure mechanical connection that resists vibration and shock. * **Installation:** Requires pre-drilled holes in the PCB. #### C. Material and Coating * **AL6063 Aluminum:** Offers high thermal conductivity while remaining lightweight. * **Blue Anodized Finish:** Not only aesthetic but provides increased surface area at a microscopic level and protects the aluminum from corrosion. --- ### 3. Application Use-Cases In electronics design, the ATS-13B-69-C2-R0 is typically used for: 1. **Processors:** Cooling CPUs or FPGAs in industrial computing. 2. **Power Electronics:** Dissipating heat from MOSFET arrays or VRMs (Voltage Regulator Modules). 3. **Networking:** Cooling high-speed switching chips in routers and servers. --- ### 4. Dimensional Drawing Summary | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 45.00 | | **Width (B)** | 45.00 | | **Height (C)** | 20.00 | | **Hole Spacing (E)** | 38.00 | | **Hole Spacing (F)** | 38.00 |