The **ATS-13B-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. Technical Specifications The part is designed for cooling electronic components such as CPUs, GPUs, or high-power transistors (IGBTs). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 35mm | | **Thermal Resistance** | 5.10°C/W (at 200 LFM) | | **Fin Style** | Straight / Cross-Cut Pin Fin | --- ### 2. Key Electronic Components This part number consists of three primary functional elements that work together to protect electronic circuits from overheating: #### A. The Heat Sink Body * **Thermal Dissipation:** The 35mm height provides a large surface area relative to its footprint. * **Pin Fin Design:** Unlike traditional extruded fins, the pin-fin architecture allows for omnidirectional airflow. This is critical in electronic enclosures where the direction of the cooling fan might vary or be turbulent. #### B. Attachment Mechanism (pushPIN™) * **Spring-Loaded Pins:** The "R0" designation refers to the specific attachment kit. It uses a spring-loaded push-pin system that ensures even pressure across the electronic chip (IC). * **Compression:** This prevents the heat sink from shifting during mechanical shock or vibration, which is vital for maintaining the integrity of the thermal interface. #### C. Thermal Interface Material (TIM) * **Pre-Applied Coating:** Most ATS parts in this series come with a pre-applied high-performance thermal interface material (like T766). This fills microscopic air gaps between the heat sink and the electronic component to maximize heat transfer. --- ### 3. Application Use Cases The ATS-13B-72-C3-R0 is typically used in the following electronic environments: * **Networking Equipment:** High-speed routers and switches. * **Power Electronics:** Power supplies and converters requiring passive or active cooling. * **Embedded Systems:** Industrial PCs where vertical space (35mm) is available for superior cooling. ---