The **ATS-13B-80-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by Advanced Thermal Solutions (ATS) for cooling electronic integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Component Overview The "maxiFLOW™" series is characterized by its unique flared fin structure, which maximizes surface area for convection cooling while maintaining a low pressure drop. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-13B-80-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 1.90°C/W (at 200 LFM) | --- ### 2. Technical Dimensions Precision sizing is critical for ensuring the heatsink fits within the PCB layout without interfering with surrounding components. | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 30.00 mm | | **Width (B)** | 30.00 mm | | **Height (C)** | 15.00 mm | | **Pitch (E)** | 35.00 mm (Hole to Hole) | | **Pitch (F)** | 35.00 mm (Hole to Hole) | --- ### 3. Key Electronic Functions While the part itself is passive (non-powered), it serves several critical roles in an electronic assembly: * **Thermal Dissipation:** It draws heat away from the semiconductor junction through conduction and releases it into the ambient air via convection. * **Thermal Interface Material (TIM):** The "C2" designation typically implies it comes with a pre-applied high-performance thermal interface material (like T766) to ensure minimal air gaps between the chip and the metal. * **Mechanical Stability:** The **pushPIN™** attachment system uses a brass component with a stainless steel spring to provide precise pressure (load) on the electronic package, ensuring consistent thermal contact without damaging the PCB. --- ### 4. Part Number Breakdown (Nomenclature) Understanding the suffix codes helps in selecting the right variant: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **13:** Series type (maxiFLOW). * **B:** Material/Fin style. * **80:** Specific design iteration/dimension set. * **C2:** Thermal Interface Material (TIM) type and color/finish. * **R0:** RoHS Compliance status (Lead-free). ---