The **ATS-13B-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Material** | Aluminum | | **Fin Style** | Straight (Fine Pitch) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | ATS-HK176-R0 | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Breakdown of the Part Number * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13B**: Specific series/mold identifier. * **91**: Designates the specific fin geometry and height (10mm). * **C3**: Indicates the material/finish (usually Blue Anodized Aluminum). * **R0**: Revision/Packaging code. --- ### 3. Key Electronic Functions While the heat sink itself is passive (no electricity flows through it), it performs critical functions for the electronic system: 1. **Thermal Resistance Management**: It reduces the junction temperature ($T_j$) of a semiconductor, preventing thermal throttling or permanent damage. 2. **Push-Pin Attachment**: The assembly uses a spring-loaded push-pin mechanism. This provides consistent pressure across the surface of the electronic chip, which is vital for effective heat transfer through the Thermal Interface Material (TIM). 3. **Low Profile Design**: At only 10mm tall, it is specifically designed for high-density electronic assemblies (like 1U servers or thin-client hardware) where vertical space is limited. --- ### 4. Thermal Performance * **Airflow Efficiency**: The "Fine Pitch" fin design is optimized for systems with active cooling (fans). * **T412 Interface**: The pre-applied T412 material is a high-performance thermal adhesive/pad that fills microscopic air gaps between the chip and the heat sink, significantly lowering thermal impedance.