ATS-13B-93-C2-R0
AI

The **ATS-13B-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits (ICs) like BGA, CPU, or FPGA.
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## 1. Technical Specifications
The following table summarizes the key physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Part Number** | ATS-13B-93-C2-R0 |
| **Fin Style** | maxiFLOW™ (Tapered Fin) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm |
| **Thermal Resistance** | 7.37°C/W (at 200 LFM) |
| **Interface Material** | T766 (Thermal Tape) |
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## 2. Component Breakdown
### A. Fin Geometry (maxiFLOW™)
The "maxiFLOW" design features a flared, tapered fin structure. This geometry is engineered to:
* Increase surface area for better convection.
* Maximize airflow across the component.
* Reduce pressure drop, allowing for smaller, quieter fans to be used in the system.
### B. Attachment Mechanism (pushPIN™)
The **pushPIN™** system is a standardized mounting method that ensures:
* **Constant Pressure:** A built-in spring provides a precise amount of compression (force) between the heat sink and the electronic component.
* **Ease of Assembly:** It can be quickly installed into pre-drilled holes in the PCB (Printed Circuit Board) using plastic or brass pins.
### C. Thermal Interface Material (TIM)
The part comes pre-applied with **T766 thermal tape**.
* **Purpose:** It fills microscopic air gaps between the component surface and the heat sink base.
* **Conductivity:** It ensures efficient heat transfer, preventing "hot spots" that could damage the silicon.
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## 3. Applications
This part is typically used in environments where space is limited but thermal loads are high:
* **Telecommunications:** Network switches and routers.
* **Industrial PC:** Embedded controllers and single-board computers.
* **Consumer Electronics:** High-end audio/video processing units.
- ⤷
What are the alternative mounting methods for ATS heat sinks besides pushPIN?
- ⤷How does the airflow direction affect the thermal resistance of this specific part?
- ⤷Can the T766 thermal tape be replaced with thermal paste for better performance?