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  • ATS-13B-93-C2-R0

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    The **ATS-13B-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits (ICs) like BGA, CPU, or FPGA. --- ## 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-13B-93-C2-R0 | | **Fin Style** | maxiFLOW™ (Tapered Fin) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | | **Thermal Resistance** | 7.37°C/W (at 200 LFM) | | **Interface Material** | T766 (Thermal Tape) | --- ## 2. Component Breakdown ### A. Fin Geometry (maxiFLOW™) The "maxiFLOW" design features a flared, tapered fin structure. This geometry is engineered to: * Increase surface area for better convection. * Maximize airflow across the component. * Reduce pressure drop, allowing for smaller, quieter fans to be used in the system. ### B. Attachment Mechanism (pushPIN™) The **pushPIN™** system is a standardized mounting method that ensures: * **Constant Pressure:** A built-in spring provides a precise amount of compression (force) between the heat sink and the electronic component. * **Ease of Assembly:** It can be quickly installed into pre-drilled holes in the PCB (Printed Circuit Board) using plastic or brass pins. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766 thermal tape**. * **Purpose:** It fills microscopic air gaps between the component surface and the heat sink base. * **Conductivity:** It ensures efficient heat transfer, preventing "hot spots" that could damage the silicon. --- ## 3. Applications This part is typically used in environments where space is limited but thermal loads are high: * **Telecommunications:** Network switches and routers. * **Industrial PC:** Embedded controllers and single-board computers. * **Consumer Electronics:** High-end audio/video processing units.
    ✨ Follow-up Questions
    • ⤷ What are the alternative mounting methods for ATS heat sinks besides pushPIN?
    • ⤷How does the airflow direction affect the thermal resistance of this specific part?
    • ⤷Can the T766 thermal tape be replaced with thermal paste for better performance?