The **ATS-13B-97-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Mounting Type** | Push Pin (Plastic) | | **Spring Type** | Brass | | **Thermal Resistance** | 2.03°C/W (at 200 LFM) | | **Airflow Path** | Straight Fin | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows the standard ATS nomenclature: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **13B**: Series identifier (specific fin geometry and mounting style). 3. **97**: Dimensional code (refers to the 45mm x 45mm footprint). 4. **C2**: Color and Finish (typically refers to Blue Anodized). 5. **R0**: Revision/Packaging code. --- ### 3. Key Features * **Straight Fin Design:** Optimized for uni-directional airflow, providing a low pressure drop and efficient heat dissipation. * **Push-Pin Attachment:** Features a flexible attachment mechanism that uses a plastic pin and a spring. This ensures a consistent pressure on the electronic component (TIM compression) without requiring tools for installation. * **Pre-applied TIM:** Comes with a **T766 phase-change material** or thermal grease pre-applied to the base, ensuring immediate installation and reliable heat transfer from the silicon to the aluminum. * **Material Efficiency:** The aluminum construction offers a balance between lightweight design and high thermal conductivity. --- ### 4. Common Applications This specific heat sink is typically found in: * **Telecommunications:** Cooling of high-speed processors in switches and routers. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Dissipating heat from large MOSFET arrays or power modules.