ATS-13B-98-C2-R0
AI

The **ATS-13B-98-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components.
Below is a detailed breakdown of its specifications and physical characteristics.
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### 1. Technical Specifications
This part is manufactured by **Advanced Thermal Solutions (ATS)** and belongs to their **blueICE™** or push-pin series.
| Feature | Specification |
| :--- | :--- |
| **Part Number** | ATS-13B-98-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin |
| **Thermal Resistance** | 15.31°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm |
| **Fin Type** | Straight Fin |
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### 2. Physical Components
The assembly consists of three primary elements:
1. **Heatsink Body:** A square aluminum block with vertical fins. The fins increase the surface area to allow air to carry heat away more efficiently.
2. **Push-Pins:** Plastic or brass spring-loaded pins that pass through pre-drilled holes in the PCB. This provides a secure, consistent downward pressure (clamping force) to ensure the sink stays in contact with the chip.
3. **Thermal Interface Material (TIM):** Usually comes pre-applied with **T766** phase-change material or similar, which fills microscopic air gaps between the component and the heatsink.
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### 3. Key Electronic Functions
While the part itself is passive (it does not require electricity), its role is critical for the electronic circuit:
* **Thermal Management:** It prevents "Thermal Throttling" where a processor slows down to protect itself from heat.
* **Component Longevity:** By keeping the junction temperature ($T_j$) low, it prevents premature failure of the semiconductor.
* **Acoustic Control:** High-efficiency heatsinks allow fans to run at lower RPMs, reducing electronic noise and physical vibration.
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### 4. Airflow Performance Data
Heatsink efficiency changes based on the speed of the air (Linear Feet per Minute - LFM) moving through it:
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100** | 15.31 |
| **200** | 5.81 |
| **400** | 3.20 |
| **600** | 2.30 |
- ⤷
What is the hole pattern requirement for the push-pin mounting?
- ⤷ How does 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
- ⤷ Can this heatsink be used for high-power CPUs or is it limited to smaller ICs?