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  • ATS-13B-98-C2-R0

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    The **ATS-13B-98-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and physical characteristics. --- ### 1. Technical Specifications This part is manufactured by **Advanced Thermal Solutions (ATS)** and belongs to their **blueICE™** or push-pin series. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-13B-98-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Thermal Resistance** | 15.31°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Fin Type** | Straight Fin | --- ### 2. Physical Components The assembly consists of three primary elements: 1. **Heatsink Body:** A square aluminum block with vertical fins. The fins increase the surface area to allow air to carry heat away more efficiently. 2. **Push-Pins:** Plastic or brass spring-loaded pins that pass through pre-drilled holes in the PCB. This provides a secure, consistent downward pressure (clamping force) to ensure the sink stays in contact with the chip. 3. **Thermal Interface Material (TIM):** Usually comes pre-applied with **T766** phase-change material or similar, which fills microscopic air gaps between the component and the heatsink. --- ### 3. Key Electronic Functions While the part itself is passive (it does not require electricity), its role is critical for the electronic circuit: * **Thermal Management:** It prevents "Thermal Throttling" where a processor slows down to protect itself from heat. * **Component Longevity:** By keeping the junction temperature ($T_j$) low, it prevents premature failure of the semiconductor. * **Acoustic Control:** High-efficiency heatsinks allow fans to run at lower RPMs, reducing electronic noise and physical vibration. --- ### 4. Airflow Performance Data Heatsink efficiency changes based on the speed of the air (Linear Feet per Minute - LFM) moving through it: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 15.31 | | **200** | 5.81 | | **400** | 3.20 | | **600** | 2.30 |
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern requirement for the push-pin mounting?
    • ⤷ How does 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
    • ⤷ Can this heatsink be used for high-power CPUs or is it limited to smaller ICs?