ATS-13D-07-C3-R0
AI

The **ATS-13D-07-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for high-density electronic cooling applications.
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## 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm |
| **Fin Style** | Straight (COARSE-PITCH) |
| **Thermal Resistance** | 17.09 °C/W @ (Unducted Flow) |
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## 2. Key Design Features
### A. pushPIN™ Attachment
This model uses the proprietary **pushPIN™** system, which replaces traditional thermal tape or clips.
* **Precision:** It ensures a constant, predefined pressure on the component.
* **Assembly:** Features a flexible spring mechanism that allows for quick installation on PCBs with pre-drilled holes.
### B. Thermal Interface Material (TIM)
The part comes pre-applied with **T412** thermal interface material. This is a high-conductivity material that fills microscopic air gaps between the heat sink base and the electronic component (CPU, FPGA, etc.), ensuring efficient heat transfer.
### C. Fin Geometry
* **Configuration:** It uses a **COARSE-PITCH** fin layout.
* **Airflow:** This design is optimized for environments where there is moderate to high airflow, allowing air to pass through the fins with minimal pressure drop.
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## 3. Applications
This heat sink is typically found in:
1. **Telecommunications:** Cooling of high-speed processors in routers and switches.
2. **Embedded Systems:** Industrial PCs where vertical space (12.7mm height) is limited.
3. **Power Electronics:** Dissipating heat from MOSFETs or power regulators.
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## 4. Ordering Information (Part Number Breakdown)
* **ATS:** Advanced Thermal Solutions.
* **13D:** Series/Style designation.
* **07:** Specific dimension/geometry code.
* **C3:** Material/Finish code (Blue Anodized).
* **R0:** Revision or packaging code.
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What are the alternatives to pushPIN™ for mounting heat sinks?
- ⤷ How does the T412 thermal interface material compare to standard thermal paste?
- ⤷ How do I calculate if the 17.09 °C/W thermal resistance is sufficient for my chip?