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  • ATS-13D-07-C3-R0

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    The **ATS-13D-07-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for high-density electronic cooling applications. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Fin Style** | Straight (COARSE-PITCH) | | **Thermal Resistance** | 17.09 °C/W @ (Unducted Flow) | --- ## 2. Key Design Features ### A. pushPIN™ Attachment This model uses the proprietary **pushPIN™** system, which replaces traditional thermal tape or clips. * **Precision:** It ensures a constant, predefined pressure on the component. * **Assembly:** Features a flexible spring mechanism that allows for quick installation on PCBs with pre-drilled holes. ### B. Thermal Interface Material (TIM) The part comes pre-applied with **T412** thermal interface material. This is a high-conductivity material that fills microscopic air gaps between the heat sink base and the electronic component (CPU, FPGA, etc.), ensuring efficient heat transfer. ### C. Fin Geometry * **Configuration:** It uses a **COARSE-PITCH** fin layout. * **Airflow:** This design is optimized for environments where there is moderate to high airflow, allowing air to pass through the fins with minimal pressure drop. --- ## 3. Applications This heat sink is typically found in: 1. **Telecommunications:** Cooling of high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where vertical space (12.7mm height) is limited. 3. **Power Electronics:** Dissipating heat from MOSFETs or power regulators. --- ## 4. Ordering Information (Part Number Breakdown) * **ATS:** Advanced Thermal Solutions. * **13D:** Series/Style designation. * **07:** Specific dimension/geometry code. * **C3:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the alternatives to pushPIN™ for mounting heat sinks?
    • ⤷ How does the T412 thermal interface material compare to standard thermal paste?
    • ⤷ How do I calculate if the 17.09 °C/W thermal resistance is sufficient for my chip?