The **ATS-13D-08-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *pushPIN™* series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications, construction, and applications. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Fin Type** | Fine-Pitch (increases surface area) | | **Base Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with Compression Springs) | | **Dimensions (LxWxH)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | ~14.6°C/W (at 100 LFM) to ~1.4°C/W (at 800 LFM) | | **Spring Material** | Brass (standard) or Stainless Steel | --- ### 2. Key Component Features #### A. Attachment Mechanism (pushPIN™) The "R0" at the end of the part number indicates the mounting hardware. This system uses flexible push-pins that click into pre-drilled holes on the PCB. * **Benefits:** Ensures constant, uniform pressure on the electronic component (CPU, GPU, or FPGA), which optimizes heat transfer. * **Security:** Prevents the heat sink from shifting during vibration or shipping. #### B. Fin Design This specific model uses a **Fine-Pitch** fin geometry. * This design is optimized for **forced air cooling** (environments with fans). * The high density of fins provides a larger surface area for heat dissipation compared to standard cross-cut designs. #### C. Thermal Interface Material (TIM) ATS usually pre-applies a high-performance **Thermal Phase Change Material** or thermal grease to the base of these sinks. This fills microscopic air gaps between the heat sink and the electronic chip to maximize thermal conductivity. --- ### 3. Applications The ATS-13D-08-C3-R0 is typically used for cooling mid-range heat-generating components in: 1. **Telecommunications:** Network switches and routers. 2. **Industrial PCs:** Compact motherboards where height is restricted (15mm profile). 3. **Power Electronics:** Voltage regulators and high-speed transistors. 4. **Embedded Systems:** High-performance ARM or FPGA modules. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **13** | Series / Frame Size Identifier | | **D** | Material / Spring Type Code | | **08** | Height (Specific to series mapping) | | **C3** | Thermal Resistance / Performance Grade | | **R0** | Finish/Color (Blue Anodized) and Attachment style |