The **ATS-13D-12-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" component cooling line, designed for thermal management of integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Component Specifications The technical attributes of this specific part number are detailed in the table below: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded Plastic Pin) | | **Base Dimension** | 50mm x 50mm | | **Height** | 15mm | | **Fin Type** | XCUT (Cross-cut for multi-directional airflow) | | **Thermal Resistance** | 15.84 °C/W (at 100 LFM) | | **Thermal Interface** | T766 (Pre-applied Thermal Grease) | --- ### 2. Breakdown of the Part Number The nomenclature for ATS products follows a specific logic: * **ATS-13**: Refers to the series (pushPIN™ Heatsink Assembly). * **D**: Indicates the hardware/attachment kit type. * **12**: Represents the specific fin pattern and geometry. * **C2**: Denotes the material and finish (typically Aluminum with a specific Blue Anodize). * **R0**: Refers to the revision or packaging version. --- ### 3. Key Electronic Cooling Features #### Multi-Directional Airflow (XCUT) Unlike standard straight-fin heatsinks that require air to flow in one specific direction, the **XCUT** design uses a cross-cut pattern. This allows the electronic component to be cooled effectively regardless of which direction the system fans are blowing. #### Attachment Mechanism (pushPIN™) This part uses a "pushPIN" system which consists of: 1. **Plastic Pins:** They snap into pre-drilled holes on the PCB. 2. **Compression Springs:** These ensure constant, high pressure between the heatsink and the chip, which is critical for efficient heat transfer. #### Thermal Interface Material (TIM) The **T766** material is pre-applied to the base. This eliminates the need for manual application of thermal paste, ensuring a consistent and clean thermal bond between the heatsink and the electronic package. --- ### 4. Typical Applications * **Networking Equipment:** Switches and Routers. * **Industrial PCs:** Compact motherboards where space is limited. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Embedded Systems:** High-performance ARM or FPGA modules.