The **ATS-13D-121-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.48°C/W (at 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 10mm (Low Profile) | | **Attachment Method** | Push-pin (Brass) | | **Spring Type** | Stainless Steel (Compression) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13**: Refers to the specific series of the product. * **D**: Indicates the spring type (standard compression spring). * **121**: Specific dimensions and internal design code. * **C2**: Indicates the thermal interface material (TIM) pre-applied (usually T766 phase-change material). * **R0**: RoHS compliance status. --- ### 3. Key Design Features * **Fine Pitch Fins:** The heat sink utilizes a high-density fin array to maximize the surface area for heat transfer while maintaining a low profile. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a mechanical push-pin system. This ensures a consistent pressure (load) on the processor, which improves thermal conductivity. * **Pre-Applied TIM:** It comes with a pre-applied Thermal Interface Material, reducing assembly time and ensuring a high-quality bond between the chip and the aluminum. * **Cross-Cut Design:** The fins are often designed to allow for "omni-directional" airflow, meaning it performs well regardless of which direction the cooling fan is blowing. --- ### 4. Typical Applications This component is commonly found in: * **Networking Hardware:** Switches, routers, and gateways. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Components requiring rapid heat dissipation in tight spaces. * **Processors/FPGAs:** Cooling low-to-mid power chips in compact enclosures.