ATS-13D-133-C2-R0
AI

The **ATS-13D-133-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by **Advanced Thermal Solutions (ATS)** as part of their "blue ice" high-performance heat sink line.
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### 1. Technical Specifications
The following table summarizes the primary physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Product Type** | Passive Heat Sink |
| **Attachment Method** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 70.00 mm x 70.00 mm x 10.00 mm |
| **Fin Configuration** | Fine Pitch (Cros-cut) |
| **Thermal Resistance** | 2.11°C/W (at 1.0 m/s airflow) |
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### 2. Electronic/Thermal Functionality
This part serves as a **passive heat exchanger**. It functions by increasing the surface area of a heat-generating electronic component (such as a CPU, FPGA, or GPU), allowing the surrounding air to carry heat away more efficiently.
* **Thermal Interface:** In a real-world electronic circuit, this part is paired with a **Thermal Interface Material (TIM)** like thermal paste or a pad to fill microscopic air gaps between the chip and the aluminum base.
* **Heat Dissipation:** The cross-cut fin design is optimized for airflow from any direction, making it versatile for dense PCB layouts.
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### 3. Key Mechanical Features
* **pushPIN™ Attachment:** Unlike adhesive tapes which can degrade, this part uses a spring-loaded pin mechanism. This ensures constant, reliable pressure between the heat sink and the component, which is critical for maintaining thermal conductivity over the lifespan of the device.
* **Low Profile:** With a height of only **10.00 mm**, this part is specifically designed for low-clearance electronic enclosures or blade servers where vertical space is restricted.
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### 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **13D** | Series/Product Family (pushPIN™ type) |
| **133** | Specific size/designator |
| **C2** | Performance class / Anodization color (Blue) |
| **R0** | Revision or packaging code |
- ⤷
What is the required PCB hole pattern for the pushPIN attachment?
- ⤷ How does the thermal resistance change at higher airflow velocities (e.g.
- ⤷ 2.0 m/s)?
- ⤷ Can this heat sink be used with a standard 80mm fan?