The **ATS-13D-137-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 10.00mm | | **Thermal Resistance** | 18.30°C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Electronic Component Breakdown #### A. The Heat Sink Body The body is made of **AL6063 aluminum**, chosen for its excellent thermal conductivity and lightweight properties. The "Blue Anodized" finish is not just aesthetic; it provides surface protection against corrosion and slightly improves radiative heat transfer. #### B. The pushPIN™ Mounting System Instead of using messy adhesives or weak thermal tape, this part uses a mechanical **pushPIN™** system. * **Spring-loaded mechanism:** Ensures constant, high-pressure contact between the heat sink and the electronic chip. * **Attachment Type:** Uses two brass pins with stainless steel springs to lock into pre-drilled holes on the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The part comes with **T766** thermal grease or pad pre-applied to the base. This is a critical "electronic part" because it fills microscopic air gaps between the chip and the aluminum, significantly lowering thermal resistance. --- ### 3. Application and Usage This specific heat sink is typically used for cooling: * **Processors (CPUs/GPUs):** Small form-factor embedded chips. * **FPGAs/ASICs:** High-speed logic gates that generate localized heat. * **Power Transistors:** Voltage regulators that require heat dissipation to prevent thermal throttling or failure. --- ### 4. Part Number Decoder Understanding the "ATS-13D-137-C2-R0" nomenclature: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **13D** | Series/Mounting style (pushPIN™) | | **137** | Specific Fin Profile / Model number | | **C2** | Material/Finish (Aluminum / Blue Anodized) | | **R0** | RoHS Compliant / Revision status |