The **ATS-13D-14-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It belongs to the "maxiFLOW" series, characterized by a unique trapezoidal fin design. --- ### 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Thermal Resistance** | 9.97°C/W @ Unducted Flow | | **Pressure Drop** | 0.14 inH2O @ 200 LFM | --- ### 2. Key Electronic & Physical Features #### A. The maxiFLOW™ Design The "maxiFLOW" geometry features a spread-fin pattern that increases the surface area while reducing pressure drop. In electronics, this is critical for high-density PCBs where airflow may be restricted. #### B. Push-Pin Attachment The `-R0` suffix indicates a specific attachment assembly. * **Mechanical Stability:** Uses a brass push-pin with a stainless steel spring. * **Pressure Control:** Provides a consistent force on the high-power component (like a BGA or FPGA), ensuring optimal interface between the chip and the heatsink. #### C. Thermal Interface Material (TIM) This specific model usually comes pre-applied with **Chomerics T766**, a high-performance phase-change material. This eliminates the need for manual thermal paste application and ensures uniform heat transfer. --- ### 3. Application Use Cases This part is commonly found in the following electronic environments: * **Telecommunications:** Cooling of high-speed processors in routers and switches. * **Industrial PC:** Cooling chipsets or embedded CPUs. * **Power Supplies:** Managing heat in localized power conversion modules. --- ### 4. Part Number Breakdown The nomenclature `ATS-13D-14-C2-R0` translates to: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **13:** Series/Type. * **D:** Attachment style (Push-Pin). * **14:** Specific height/configuration code. * **C2:** Blue Anodized finish (usually indicates specific thermal properties). * **R0:** Revision or packaging code.