The **ATS-13D-141-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Thermal Resistance** | 15.71°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight Fin | --- ## 2. Key Components & Design Features ### A. pushPIN™ Attachment Unlike adhesive tapes that can fail over time, this part uses the **pushPIN™** system. This consists of: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Ensure consistent downward pressure on the electronic component for optimal heat transfer. ### B. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the part comes with a pre-applied **Thermal Interface Material**. This is a layer of conductive paste or pad that fills microscopic air gaps between the heat sink and the chip. ### C. Fin Geometry The **Straight Fin** design is optimized for environments where there is a consistent airflow. The spacing between the fins is engineered to minimize pressure drop while maximizing the surface area exposed to the air. --- ## 3. Identification via Part Number The part number can be broken down to understand the specific configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **13D** | Series (pushPIN™ Heat Sink) | | **141** | Specific Model/Form Factor | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Packaging/TIM Specification | --- ## 4. Usage Considerations * **PCB Footprint:** Since this uses pushPINs, your PCB must have two specific mounting holes spaced correctly around the chip. * **Airflow Direction:** Because it uses straight fins, it is most effective when the airflow is parallel to the fins. * **Thermal Budget:** With a thermal resistance of roughly 15.71°C/W at low airflow, it is suited for mid-to-low power components or high-airflow environments.