The **ATS-13D-150-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties: | Feature | Specification | | :--- | :--- | | **Product Type** | Push-Pin Heat Sink | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 25.0mm | | **Thermal Resistance** | 4.82°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Interface Material** | T766 (Pre-applied Thermal Phase Change Material) | --- ### 2. Design and Components The "150" series belongs to the **push-PIN™** line, which focuses on ease of assembly and high thermal efficiency. #### A. Fin Design The heat sink features a **straight fin** or **cross-cut** design (depending on the specific revision), optimized for airflow. The 25mm height provides a large surface area for heat exchange relative to its 35x35mm footprint. #### B. The Push-Pin Mechanism Instead of using messy adhesives or tapes, this part uses a mechanical fastening system: * **Pins:** Usually made of brass or plastic; these go through pre-drilled holes in the PCB. * **Springs:** Provide constant pressure between the heat sink and the chip, ensuring maximum thermal contact even under vibration. #### C. Thermal Interface Material (TIM) The **C2** designation typically refers to the thermal interface material pre-applied to the base. This fills microscopic air gaps between the component and the heat sink. --- ### 3. Usage Context This part is commonly found in the following applications: * **Networking:** Routers, switches, and base stations. * **Computing:** Cooling chipsets, GPUs, or small CPUs on embedded motherboards. * **Power Electronics:** Dissipating heat from high-speed transistors or power modules. ### 4. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how many degrees the temperature rises per watt of power dissipated. ```text Airflow (LFM) | Thermal Resistance (°C/W) ----------------------------------------- 100 (0.5 m/s) | 6.50 200 (1.0 m/s) | 4.82 300 (1.5 m/s) | 4.10 400 (2.0 m/s) | 3.50 ``` ---