The **ATS-13D-152-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, ASICs, and chipsets. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-13D-152-C2-R0 | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 3.32°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 25.0mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of Components #### A. The Heat Sink Body The body is made of **extruded aluminum**. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The "Blue Anodized" finish is not just aesthetic; it provides surface protection and slightly improves emissivity for radiant heat transfer. #### B. Attachment Mechanism (Push Pins) Instead of using messy adhesives or permanent solder, this part uses **brass push pins**. * **Ease of Use:** Allows for quick installation and removal during prototyping. * **Reliability:** Provides consistent downward pressure on the electronic chip, ensuring a tight seal with the thermal interface. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the chip surface and the heat sink base. * **Advantage:** Since air is a poor conductor of heat, the TIM ensures maximum heat flow (low thermal resistance) from the electronic part to the aluminum fins. --- ### 3. Performance Data (Airflow) The efficiency of this part varies based on the velocity of the air moving through the system (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 3.32 | | 400 (2.0 m/s) | 2.11 | | 600 (3.0 m/s) | 1.69 | --- ### 4. Ideal Applications * **BGA (Ball Grid Array) Components:** Standard cooling for high-speed processors. * **Telecommunications:** Used in routers and switches. * **Industrial PC:** Cooling for embedded systems where vibration resistance is needed (provided by the push-pin springs). ---