The **ATS-13D-166-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *pushPIN™* series manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. Technical Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Brass with Plastic T-Series) | | **Fin Type** | Flat Fin (Square) | | **Thermal Resistance** | 12.30°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 25mm x 25mm x 15mm | | **Surface Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Functional Design Parts This component is more than just a piece of metal; it is a system designed to protect sensitive integrated circuits (ICs). #### A. The Fin Geometry The "Flat Fin" design is optimized for high-density electronic boards. The square footprint (25mm) is sized specifically for small processors, FPGAs, or power regulators. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **ATS-13D-166-C3-R0** uses a mechanical push-pin system. * **Pressure Control:** The built-in spring ensures a consistent downward force (pressure) on the chip. * **Reliability:** Mechanical mounting is more durable than thermal tape in high-vibration environments (e.g., aerospace or automotive electronics). #### C. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied. This is a high-performance thermal pad/grease that fills the microscopic air gaps between the electronic component and the aluminum surface, drastically improving heat transfer efficiency. --- ### 3. Thermal Performance Matrix Thermal resistance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 12.18 | 7.42 | 5.58 | 4.66 | --- ### 4. Typical Applications * **BGA Cooling:** Ball Grid Array chips that generate moderate heat. * **Network Switches:** Used on high-speed data processing chips. * **Power Supplies:** Cooling voltage regulators to prevent thermal throttling.