The **ATS-13D-174-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of their "pushPIN™" thermal management line, specifically designed to cool electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number encodes specific data regarding its physical dimensions and thermal performance. | Specification | Value | Details | | :--- | :--- | :--- | | **Dimensions (L x W)** | 30.00 x 30.00 mm | The footprint of the heat sink base. | | **Height** | 25.00 mm | Vertical clearance required. | | **Material** | Aluminum | Lightweight with high thermal conductivity. | | **Finish** | Blue Anodized | Enhances corrosion resistance and emissivity. | | **Thermal Resistance** | 4.02 °C/W (@ 100 LFM) | Rate of heat transfer at low airflow. | | **Attachment Method** | pushPIN™ | Uses a spring-loaded pin for mounting. | | **Thermal Interface** | T766 | High-performance thermal phase change material. | --- ### 2. Component Breakdown #### A. The Fin Design (Cross-Cut) The "174" series typically utilizes a **cross-cut** or **pin-fin** design. This pattern increases the surface area exposed to air and allows for "omnidirectional" airflow, meaning the heat sink remains effective regardless of which direction the fan is blowing. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or simple clips, this part uses a plastic or brass pin with a stainless steel spring. * **Benefits:** Provides consistent pressure (force) on the electronic chip, ensuring optimal contact with the thermal interface material. * **Hole Pattern:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The **-C2** designation indicates that the heat sink comes pre-applied with **ATS-T766**. This is a high-performance thermal grease/pad that fills microscopic air gaps between the component and the heat sink base to maximize heat transfer. --- ### 3. Part Number Decoder Understanding the "ATS-13D-174-C2-R0" syntax: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **13**: Series/Style (pushPIN™). 3. **D**: Spring Type (typically indicates a specific tension/force). 4. **174**: Specific Fin Pattern/Height profile. 5. **C2**: Thermal Interface Material type (T766). 6. **R0**: Revision/RoHS compliance status. --- ### 4. Typical Applications * **Networking Gear:** Cooling chips in routers and switches. * **Embedded Systems:** Industrial PCs where space is limited but heat is high. * **Power Electronics:** Cooling MOSFETs or small voltage regulators.