The **ATS-13D-178-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin | | **Thermal Resistance** | 4.82°C/W (at 100 LFM) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height** | 15.00mm | | **Finish** | Blue Anodized | | **Spring Type** | Brass, Nickel Plated | --- ## 2. Component Design & Architecture ### A. Fin Profile (Top Performance) The "178" in the part number indicates a specific fin pattern. These are typically **straight fins** or **cross-cut fins** designed to maximize surface area while allowing air to flow through the heat sink with minimal pressure drop. ### B. Attachment Mechanism: pushPIN™ Instead of messy thermal adhesives or fragile clips, this part uses a **Push-Pin** system: * **Compression Spring:** Provides a precise amount of downward pressure (Force) to ensure optimal contact between the heat sink and the chip. * **Ease of Install:** Allows for quick assembly and easy removal for maintenance without damaging the PCB. ### C. Thermal Interface Material (TIM) The "C2" suffix indicates that this specific model comes pre-applied with **T766 thermal phase change material**. This eliminates the need for manual thermal paste application and ensures a consistent, high-quality thermal bond. --- ## 3. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM) provided by system fans. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.82 | | 200 (1.0 m/s) | 2.85 | | 300 (1.5 m/s) | 2.30 | | 400 (2.0 m/s) | 2.00 | --- ## 4. Key Advantages 1. **Uniform Pressure:** The push-pin and spring assembly ensure that the heat sink sits perfectly flat on the component, preventing "hot spots." 2. **Lightweight:** Made of Aluminum 6063, it provides a high strength-to-weight ratio, reducing mechanical stress on the PCB. 3. **Corrosion Resistance:** The blue anodized finish provides an oxide layer that protects the aluminum from environmental degradation. ---