The **ATS-13D-181-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide efficient cooling for electronic components such as CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-13D-181-C2-R0 | | **Material** | Aluminum (with Blue Anodized finish) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 11.95°C/W (at 200 LFM) | | **Airflow Path** | High-performance spread-fin pattern | --- ### 2. Design and Component Breakdown #### A. Fin Geometry (maxiFLOW™) The "spread-fin" design is the defining characteristic of this part. Unlike standard straight fins, these fins flare outwards. This increases the surface area and encourages turbulent airflow, which significantly enhances heat dissipation in constrained spaces. #### B. The pushPIN™ Attachment System The part includes a specialized mounting mechanism: * **Spring-loaded Pins:** These ensure a consistent, pre-determined pressure is applied to the electronic chip. * **Brass/Plastic components:** High-quality springs and pins prevent the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The **C2** in the part number indicates that the heat sink comes pre-applied with **T766 phase-change material**. This is a thermal pad that melts and fills microscopic air gaps between the chip and the heat sink once it reaches operating temperature, ensuring maximum heat transfer. --- ### 3. Part Number Decoding Understanding the nomenclature helps identify the specific features: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **13** | Attachment Type: pushPIN™ | | **D** | Material/Series variation | | **181** | Specific dimensional footprint (40x40mm) | | **C2** | Thermal Interface: T766 Phase Change Material | | **R0** | RoHS Compliant / Revision code | --- ### 4. Applications This electronic part is typically found in: * **Networking Gear:** Switches and routers where airflow is directional. * **Industrial PCs:** Compact systems requiring high-reliability cooling. * **Power Supplies:** Cooling MOSFETs or voltage regulators.