The **ATS-13D-192-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to ensure system stability and longevity. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | pushPIN™ Heat Sink | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 2.35°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 35.00mm | | **Spring Type** | Stainless Steel (ATS-PP-04) | | **TIM (Interface Material)** | T766 (Pre-applied) | --- ### Key Components & Features #### 1. Heat Sink Body (The Fin Array) The "192" series utilizes a **Straight Fin** design. * **Material:** It is made of Aluminum (6063) for high thermal conductivity and lightweight properties. * **Dimensions:** With a 35mm height, it provides a large surface area for convection cooling, suitable for high-power components. #### 2. The pushPIN™ Attachment System This specific model uses the ATS pushPIN™ system, which consists of: * **Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** These ensure constant, uniform pressure on the component, improving the thermal contact. #### 3. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a thermal grease or pad located on the base of the heat sink. It fills microscopic air gaps between the heat sink and the electronic chip (CPU/GPU/FPGA) to maximize heat transfer. #### 4. Blue Anodized Finish The blue coating is not just for aesthetics; anodizing increases the surface emissivity, which slightly improves heat radiation and provides a durable, corrosion-resistant surface. --- ### Thermal Performance Overview | Airflow Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 2.35 | 1.41 | 1.17 | 1.05 | 0.95 | *Calculated for unducted flow.* ---