ATS-13D-27-C2-R0
AI

The **ATS-13D-27-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-13D-27-C2-R0 |
| **Material** | Aluminum (Extruded) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Resistance** | 12.24°C/W (at 100 LFM) |
| **Thermal Interface Material** | T766 (High Performance Pre-applied) |
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### 2. Physical Dimensions
The physical size of the heatsink is critical for PCB layout and clearance.
* **Length:** 40.00 mm
* **Width:** 40.00 mm
* **Height:** 12.70 mm
* **Fin Style:** Straight Fin (optimized for unidirectional airflow)
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### 3. Electronic Design Considerations
When integrating this part into an electronic system, engineers focus on three main aspects:
#### A. Thermal Performance
The "C2" in the part number indicates a specific thermal profile. As airflow increases, the resistance drops significantly:
* **100 LFM:** 12.24°C/W
* **400 LFM:** 4.10°C/W
* **700 LFM:** 2.90°C/W
#### B. Attachment & Mounting
This part uses a **push-pin and spring** mechanism.
* **Hole Pattern:** Usually requires two 3.0mm holes on the PCB.
* **Spring Rate:** Provides consistent pressure for the Thermal Interface Material (TIM) to eliminate air gaps.
#### C. Component Compatibility
The **40x40mm** footprint is a standard size for:
* BGA (Ball Grid Array) chips.
* FPGA (Field Programmable Gate Arrays).
* Mid-range processors in industrial embedded systems.
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### 4. Part Number Decoder (Quick Reference)
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions |
| **13** | Series (Push-Pin) |
| **D** | Material / Design Variation |
| **27** | Specific Model ID |
| **C2** | Performance / Finish Class |
| **R0** | RoHS Compliant Revision |
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- ⤷
What is the significance of the T766 thermal interface material used on this heatsink?
- ⤷ How do I calculate if the 12.24°C/W thermal resistance is sufficient for my chip?
- ⤷ Are there alternative mounting options if my PCB does not have push-pin holes?