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  • ATS-13D-27-C2-R0

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    The **ATS-13D-27-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-13D-27-C2-R0 | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 12.24°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (High Performance Pre-applied) | --- ### 2. Physical Dimensions The physical size of the heatsink is critical for PCB layout and clearance. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 12.70 mm * **Fin Style:** Straight Fin (optimized for unidirectional airflow) --- ### 3. Electronic Design Considerations When integrating this part into an electronic system, engineers focus on three main aspects: #### A. Thermal Performance The "C2" in the part number indicates a specific thermal profile. As airflow increases, the resistance drops significantly: * **100 LFM:** 12.24°C/W * **400 LFM:** 4.10°C/W * **700 LFM:** 2.90°C/W #### B. Attachment & Mounting This part uses a **push-pin and spring** mechanism. * **Hole Pattern:** Usually requires two 3.0mm holes on the PCB. * **Spring Rate:** Provides consistent pressure for the Thermal Interface Material (TIM) to eliminate air gaps. #### C. Component Compatibility The **40x40mm** footprint is a standard size for: * BGA (Ball Grid Array) chips. * FPGA (Field Programmable Gate Arrays). * Mid-range processors in industrial embedded systems. --- ### 4. Part Number Decoder (Quick Reference) | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **13** | Series (Push-Pin) | | **D** | Material / Design Variation | | **27** | Specific Model ID | | **C2** | Performance / Finish Class | | **R0** | RoHS Compliant Revision | ---
    ✨ Follow-up Questions
    • ⤷ What is the significance of the T766 thermal interface material used on this heatsink?
    • ⤷ How do I calculate if the 12.24°C/W thermal resistance is sufficient for my chip?
    • ⤷ Are there alternative mounting options if my PCB does not have push-pin holes?