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  • ATS-13D-34-C2-R0

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    The **ATS-13D-34-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Mounting Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 6.73°C/W (Natural Convection) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 30.00mm | | **Attachment Method** | ATS-CP-1014 (Spring-loaded push pin) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features * **Heat Sink Geometry:** This model utilizes a **cross-cut** or **pin-fin** design. This structure allows for multi-directional airflow, making it highly efficient in systems where the direction of the cooling air may vary. * **push-pin Attachment:** The "R0" designation refers to the specific attachment kit. It uses plastic push-pins and a compression spring. This ensures constant pressure between the heat sink and the component, optimizing thermal transfer. * **Blue Anodized Finish:** The aluminum is treated with a blue anodized coating, which increases surface emissivity (improving radiation cooling) and provides corrosion resistance. * **Pre-Applied TIM:** It comes with **T766 thermal phase change material**. This eliminates the need for manual application of thermal paste, ensuring a consistent and clean thermal bond during assembly. --- ### 3. Thermal Performance Analysis Thermal resistance measures how effectively the part moves heat away from the silicon. Lower numbers are better under forced airflow conditions: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Natural Convection** | 6.73 | | **200 LFM (Linear Feet per Min)** | 3.57 | | **500 LFM** | 2.11 | | **800 LFM** | 1.60 | --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13D**: Series designation (Push-pin type). * **34**: Specific footprint/size category. * **C2**: Material/Finish code (Blue Anodized). * **R0**: Revision or specific packaging/attachment kit code.
    ✨ Follow-up Questions
    • ⤷ What are the benefits of using a push-pin mount over adhesive thermal tape?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used for a 40mm x 40mm chip despite its 35mm base?