The **ATS-13D-38-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Fin Style** | Fine Pitch (Straight) | | **Thermal Resistance (Unducted)** | 6.42 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 22.86mm | | **Weight** | ~40-50 grams | --- ### 2. Component Breakdown The part number follows a specific nomenclature used by ATS to describe its characteristics: * **ATS-13**: Refers to the product family and attachment style (pushPIN™). * **D**: Indicates a specific spring force or hardware configuration. * **38**: Represents the base dimension (approx. 37-38mm). * **C2**: Refers to the material and finish (Blue Anodized Aluminum). * **R0**: Indicates the revision number of the design. ### 3. Key Design Features 1. **Fine-Pitch Fin Design**: The fins are spaced closely together to maximize surface area, making it ideal for systems with high-velocity airflow (ducted or forced air). 2. **pushPIN™ Attachment**: Instead of using adhesives or standard screws, it uses a spring-loaded pin mechanism. This provides: * **Consistent Pressure**: Ensures optimal contact between the heat sink and the chip. * **Quick Assembly**: Can be installed rapidly on PCBs with pre-drilled holes. 3. **Thermal Interface Material (TIM)**: These units typically come pre-applied with a high-performance thermal phase-change material (like T766) on the base to reduce thermal resistance between the component and the sink. --- ### 4. Application Use-Cases * **Embedded Systems**: Cooling processors in industrial computers. * **Telecommunications**: Cooling ASICs in networking switches or routers. * **Power Electronics**: Managing heat in high-efficiency power converters.