The **ATS-13D-50-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 19.03°C/W (@ 1.0 m/s) | | **Spring Type** | Compression Spring | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to define the dimensions and hardware: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13**: Series/Family type. * **D**: Material/Thermal interface designation. * **50**: Specific size/profile code (related to the 30x30mm footprint). * **C2**: Thermal Performance/Material grade (Al6063). * **R0**: RoHS Compliance and standard packaging. --- ### 3. Key Electronic Functions While the heat sink itself is passive (non-electronic), it is critical for the longevity of the electronic assembly: * **Heat Dissipation:** It increases the surface area of the heat-generating component, allowing air to carry away thermal energy more efficiently. * **Thermal Protection:** By maintaining the junction temperature ($T_j$) below the manufacturer's limit, it prevents thermal throttling and permanent silicon damage. * **EMI Shielding (Secondary):** Depending on the grounding of the push-pins, a metal heat sink can sometimes assist in reducing electromagnetic interference, though its primary role is cooling. --- ### 4. Installation Hardware The "Push-Pin" mechanism is a major feature of this part: 1. **Brass Push-Pins:** Provide durable attachment points to the PCB. 2. **Compression Springs:** Ensure a consistent "downward force" (pressure) on the chip to minimize the air gap between the component and the heat sink. 3. **Pre-applied TIM:** Usually comes with a high-performance thermal interface material (like ATS-52) on the base to fill microscopic voids. ---