The **ATS-13D-66-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for cooling electronic components such as CPUs, GPUs, and other high-power surface-mount devices. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | Details | | :--- | :--- | :--- | | **Dimensions (LxWxH)** | 45mm x 45mm x 35mm | Large surface area for heat dissipation. | | **Material** | Aluminum | Lightweight with high thermal conductivity. | | **Finish** | Blue Anodized | Increases corrosion resistance and emissivity. | | **Attachment Type** | pushPIN™ | Spring-loaded plastic or brass pins. | | **Thermal Resistance** | 0.80 °C/W (at 200 LFM) | Lower value indicates better cooling. | | **Pressure Drop** | 0.15 (at 200 LFM) | Resistance to airflow within the system. | --- ### 2. Component Analysis #### A. The Heat Sink Profile The ATS-66-C2-R0 features a **Straight-Fin** design. This pattern is optimized for unidirectional airflow, making it ideal for rack-mounted systems or enclosures with dedicated intake/exhaust fans. #### B. Attachment Mechanism (pushPIN™) The "pushPIN" system eliminates the need for messy thermal adhesives. It utilizes: - **Flexible Springs:** Ensures consistent downward pressure (7-10 lbs) on the electronic component for optimal thermal contact. - **Varying Pin Lengths:** Designed to fit various PCB thicknesses and hole sizes. #### C. Thermal Interface Material (TIM) * **Pre-applied TIM:** Usually comes with **T766** (a high-performance thermal grease or phase-change material) pre-applied to the base to ensure immediate installation readiness. --- ### 3. Application Use Cases This specific part is commonly found in the following electronic sectors: 1. **Telecommunications:** High-speed routers and switches. 2. **Data Centers:** Server motherboards and storage controllers. 3. **Industrial Computing:** Embedded systems that require passive cooling under forced-air conditions. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 1.20 | 0.80 | 0.65 | 0.55 | 0.48 | ---