The **ATS-13D-67-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 2.03° C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Fin Style** | Straight Fin | --- ### 2. Key Electronic Functions While the heat sink itself does not have circuitry, its role in an electronic system is critical for stability: * **Thermal Dissipation:** It increases the surface area of a semiconductor package, allowing heat to transfer into the ambient air via convection. * **Protection:** By maintaining lower junction temperatures, it prevents **Thermal Throttling** and extends the Mean Time Between Failures (MTBF) of the processor. * **Phase Change Material (PCM):** This specific model typically comes with **T766** pre-applied thermal interface material, which fills microscopic air gaps between the component and the heat sink. --- ### 3. Mechanical Design Features The "67" in the part number refers to the specific configuration of the fins and attachment mechanism. * **Push-Pin Mounting:** This allows for easy assembly onto a Printed Circuit Board (PCB) without the need for tools. The pins are inserted into pre-drilled holes in the PCB. * **Spring Loading:** The compression springs ensure even pressure across the component surface, which optimizes thermal transfer and prevents the heat sink from shifting during vibration. * **Low Profile:** At only 10mm high, it is ideal for space-constrained applications like 1U servers or thin embedded systems. --- ### 4. Part Number Breakdown (Naming Convention) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **13D** | Series (Push-pin heat sink series) | | **67** | Specific Fin/Base Geometry | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision code |