The **ATS-13D-71-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-13D-71-C2-R0 | | **Heat Sink Type** | Push Pin (Spring-loaded) | | **Material** | Aluminum (Blue Anodized Finish) | | **Thermal Resistance** | 6.67°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Fin Style** | Straight (optimized for airflow) | | **Thermal Interface Material (TIM)** | T766 (High Performance Pre-applied) | --- ### 2. Physical Design & Construction * **Fin Profile:** The heat sink features a vertical fin arrangement. This design is optimized for environments with consistent airflow (forced convection), allowing air to pass through the channels and carry away heat efficiently. * **Material Composition:** It is made from extruded aluminum. Aluminum is preferred for its high thermal conductivity and lightweight properties. The **Blue Anodized** coating protects against corrosion and increases surface emissivity. * **Height:** At 30mm tall, this is a mid-profile heat sink, suitable for cases where vertical clearance is available but not excessive. --- ### 3. Attachment Mechanism: Push Pin The "Push Pin" system is a critical electronic hardware feature: * **Ease of Install:** It uses a brass or plastic pin with a pre-installed compression spring. This ensures consistent pressure across the chip surface. * **Hole Pattern:** It requires pre-drilled holes in the Printed Circuit Board (PCB). * **Reliability:** Unlike adhesive tapes, push pins provide a mechanical lock that prevents the heat sink from shifting under vibration or high temperatures. --- ### 4. Thermal Performance Context The thermal resistance of **6.67°C/W** means that for every Watt of power dissipated by the electronic component, the temperature of the component will rise 6.67 degrees Celsius above the ambient air temperature (assuming an airflow of 100 linear feet per minute). --- ### 5. Common Applications * **Integrated Circuits (ICs):** Cooling FPGAs, ASICs, or Processors. * **Power Electronics:** Cooling MOSFETs or voltage regulators. * **Networking Gear:** Used in routers and switches where air is moved by internal fans.