The **ATS-13D-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### ## Technical Specifications The following table summarizes the core technical attributes of the ATS-13D-75-C1-R0: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.47°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W)** | 25.00mm x 25.00mm | | **Height (Height Off Base)** | 30.00mm | | **Pitch** | Fine Pitch | --- ### ## Component Design and Features #### 1. Heat Sink Profile (Fine Pitch) The "75" in the part number denotes a specific fin pattern. This model uses a **fine-pitch** straight fin design. This increases the total surface area, making it highly effective in environments with high-velocity forced air (fans). #### 2. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat transfer. #### 3. Attachment Mechanism (pushPIN™) This part utilizes a push-pin mechanism rather than adhesive. This provides several benefits: * **Constant Pressure:** The integrated springs ensure consistent contact between the heat sink and the component (CPU/GPU/FPGA), which is vital for thermal efficiency. * **Pre-assembled:** It usually comes with a **Thermal Interface Material (TIM)** pre-applied to the base, simplifying the assembly process. --- ### ## Applications This heat sink is typically found in the following electronic sectors: * **Telecommunications:** Cooling for high-speed routers and switches. * **Embedded Systems:** For industrial PCs where space is limited but heat generation is high. * **Power Supplies:** Managing heat for MOSFETs or voltage regulators. ---