The **ATS-13D-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its electronic and physical specifications. --- ## 1. Core Specifications This part belongs to the **pushPIN™** series, designed for easy installation and high thermal efficiency on Printed Circuit Boards (PCBs). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-13D-79-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.63°C/W (at 100 LFM) | --- ## 2. Dimensional Data Precise dimensions are critical for ensuring the part fits within the "keep-out" zones of a PCB layout. * **Length:** 25.00 mm * **Width:** 25.00 mm * **Height:** 30.00 mm (High profile for vertical clearance) * **Pitch:** Square 25mm footprint --- ## 3. Thermal Performance Metrics Thermal resistance measures the effectiveness of the heat sink in transferring heat away from the semiconductor (CPU, GPU, or MOSFET). Lower values are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 2.63 | | **300 (1.5 m/s)** | 1.58 | | **500 (2.5 m/s)** | 1.31 | | **700 (3.5 m/s)** | 1.17 | --- ## 4. Key Electronic Components Features ### Push-Pin Mounting System Instead of using messy adhesives or permanent thermal epoxy, this part uses a **push-pin and brass spring** mechanism. * **Reliability:** Provides consistent pressure (Pre-assembled with a 27-gauge spring). * **Ease of Maintenance:** Can be removed for chip inspection or thermal paste re-application. ### Thermal Interface Material (TIM) The "R0" suffix indicates that the part typically comes with a pre-applied **Thermal Interface Material** (usually T412 or similar), ensuring a low-resistance thermal path between the component and the aluminum fins. ### Fin Design The **Straight Fin** pattern is optimized for "omni-directional" or specific directional airflow, allowing the heat to dissipate into the ambient air of the electronic enclosure. ---