The **ATS-13D-85-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is a high-performance heat sink designed for thermal management of integrated circuits (ICs) and other electronic packages. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 30mm | | **Fin Type** | Fine Pitch (Cross-Cut) | | **Thermal Resistance** | 0.93°C/W @ 200 LFM | --- ### 2. Key Components & Design Features #### A. Fin Design (Cross-Cut) The unit features a **cross-cut fin pattern**. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This is critical in dense electronic enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the heat sink. #### B. Push-Pin Attachment The "-R0" designation refers to the attachment mechanism. It uses a **push-pin and brass spring** assembly. * **Reliability:** Ensures consistent pressure (clamping force) against the chip. * **Ease of Install:** No screws required; pins snap into pre-drilled holes in the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The part typically comes with a pre-applied **Phase Change Material (PCM)** or a high-performance thermal pad. This fills the microscopic air gaps between the heat sink base and the electronic component, maximizing heat transfer. --- ### 3. Part Number Breakdown (Decoding) To understand the specific configuration of `ATS-13D-85-C3-R0`, the suffix codes are interpreted as follows: | Code Segment | Meaning | | :--- | :--- | | **ATS-13** | Series identifier (pushPIN™ Thermal Management) | | **D** | Attachment Hole Diameter/Style | | **85** | Specific geometry/fin configuration | | **C3** | Thermal Interface Material (TIM) type/Base Finish | | **R0** | RoHS compliant and Revision level | --- ### 4. Application Use-Cases * **CPU/GPU Cooling:** Used for small processors in embedded systems. * **ASICs & FPGAs:** Ideal for high-speed logic devices that generate significant heat in a small footprint (35x35mm). * **Telecommunications:** Used in routers and switches where vertical space (30mm height) is available but airflow is turbulent.