The **ATS-13E-01-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Style** | XCUT (Cross-cut) | | **Thermal Resistance** | 21.93°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Electronic & Mechanical Components #### A. The Heat Sink Body (Aluminum 6063) The core component is the aluminum body. Aluminum is chosen for its high thermal conductivity and lightweight properties. The **XCUT** design features a square-fin pattern that allows for multidirectional airflow, making it ideal for systems where the direction of the air from cooling fans might vary. #### B. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or complex screws, this part uses a **Push-Pin** system: * **Springs:** Pre-assembled with a high-performance compression spring to provide precise pressure (load) on the electronic component. * **Pins:** Designed to snap into pre-drilled holes on the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates the inclusion of a high-performance **Thermal Interface Material**. This is a pre-applied phase-change material or thermal pad on the bottom of the heat sink that fills microscopic air gaps between the chip and the heat sink to maximize heat transfer. --- ### 3. Application Use Cases This specific part is used in environments where vertical space is limited (low profile) but high heat dissipation is required: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial motherboards. * **Power Electronics:** Voltage regulators and high-speed memory modules.