The **ATS-13E-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. Below is a detailed breakdown of its specifications and features. --- ### 1. General Specifications This part belongs to the **pushPIN™** series, designed for easy and secure attachment to Printed Circuit Boards (PCBs). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-13E-41-C2-R0 | | **Product Type** | Heat Sink (Square, Blue Anodized) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Material** | Aluminum (AL6063) | | **Thermal Resistance** | 10.02 °C/W (at 100 LFM) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the component fits within the spatial constraints of a device and covers the target heat source (CPU, FPGA, or Power Transistor). | Dimension | Value | | :--- | :--- | | **Length/Width** | 40.00 mm x 40.00 mm | | **Height** | 17.50 mm | | **Pitch (Hole spacing)** | 45.00 mm | | **Fin Pattern** | Square-Cut (Cross-cut) | --- ### 3. Thermal Performance Thermal resistance indicates how efficiently the heat sink moves heat away from the component. Lower values are better for cooling. * **Unducted Flow (100 LFM):** 10.02 °C/W * **Ducted Flow (200 LFM):** 2.00 °C/W * **Velocity Efficiency:** As airflow (LFM - Linear Feet per Minute) increases, the cooling efficiency improves significantly due to the cross-cut fin design which allows for multi-directional airflow. --- ### 4. Component Material & Finish * **Base Material:** Aluminum (AL6063), chosen for its excellent thermal conductivity and lightweight properties. * **Finish:** **Blue Anodized**. This coating provides corrosion resistance and improves emissivity (heat radiation). * **Thermal Interface Material (TIM):** Typically comes with **T766** pre-applied (a high-performance thermal phase-change material) to ensure a solid thermal bond between the chip and the sink. --- ### 5. Application Benefits * **Ease of Installation:** The push-pin mechanism uses a flexible spring to provide the exact amount of pressure required for optimal thermal contact without damaging the PCB. * **Cross-Cut Design:** The "brick" or square-cut pattern allows air to move through the fins from any direction, making it ideal for systems with complex or shifting airflow patterns.