The **ATS-13E-72-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Material** | Aluminum (Al6063) | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Style** | Straight Fin (Extrusion) | | **Thermal Resistance** | 5.11°C/W (at 200 LFM) | | **Finish** | Blue Anodized | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design and Component Breakdown #### A. Fin Geometry The "72" in the part number identifies the specific fin profile. This model uses a straight-fin design, which is optimized for **forced-air cooling** (airflow from a fan). The spacing between fins is calculated to minimize pressure drop while maximizing surface area for heat dissipation. #### B. Push Pin Mounting System Unlike adhesive-based heat sinks, the **R0** designation indicates a mechanical mounting system. * **Reliability:** Mechanical pins ensure the heat sink remains in constant contact with the chip, even under high vibration or thermal expansion. * **Spring-Loaded:** The pins usually include a stainless steel spring to provide a specific "preload" force on the electronic package. #### C. Thermal Interface Material (TIM) This part comes with **T766** pre-applied to the base. * **Purpose:** It fills the microscopic air gaps between the component surface and the heat sink base. * **Efficiency:** Eliminating these air gaps is critical, as air is a poor conductor of heat. #### D. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** Beyond aesthetics, the anodized layer provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer. --- ### 3. Application Use Cases This specific heat sink is typically found in: 1. **Network Switches/Routers:** Cooling high-speed processors. 2. **Industrial PCs:** Where mechanical mounting is preferred over tape for durability. 3. **Power Supplies:** Cooling MOSFETs or power regulators. ---