The **ATS-13E-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **maxiFLOW™** series, known for its high-aspect-ratio fin design. --- ### 1. Technical Specifications The part number provides specific details about its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | maxiFLOW (Tapered) | | **Dimensions (L x W x H)** | 45mm x 40mm x 30mm | | **Thermal Resistance** | 1.97 °C/W (@ 100 LFM) | | **Flow Direction** | Longitudinal | --- ### 2. Electronic/Physical Features #### A. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this part uses the **pushPIN™** system. It consists of a spring-loaded brass pin that provides: * **Uniform Pressure:** Ensures a consistent interface between the heat sink and the electronic component (CPU, FPGA, or GPU). * **Secure Fit:** Prevents the heat sink from shifting during mechanical shock or vibration. #### B. maxiFLOW™ Fin Design The fins are designed with a specific taper. In electronic enclosures where airflow is limited, this design: * Reduces pressure drop. * Increases the surface area relative to the footprint. * Maximizes "wash" (air contact) over the fins to carry heat away more efficiently than standard extruded heat sinks. #### C. Thermal Interface Material (TIM) The **"R0"** suffix usually indicates that the part comes with a pre-applied high-performance thermal interface material (like a phase-change material or thermal pad). This eliminates the need for manual application of thermal paste, ensuring optimal heat transfer from the silicon to the aluminum. --- ### 3. Application Examples This specific heat sink is typically used for cooling: 1. **High-speed Networking Chips:** Ethernet switches and routers. 2. **Power Electronics:** Voltage regulator modules (VRMs). 3. **Processors:** Mid-range FPGAs or ASICs found in industrial automation equipment. --- ### 4. Code Representation (Thermal Data) Engineers often model the thermal performance of this part in simulation environments (like Python or MATLAB) using the following simplified thermal resistance logic: ```python # Simplified Thermal Calculation for ATS-13E-75-C3-R0 def calculate_junction_temp(ambient_temp, power_dissipation, r_theta): """ Calculates the temperature of the electronic component. r_theta: Thermal Resistance (C/W) """ return ambient_temp + (power_dissipation * r_theta) # Data for ATS-13E-75-C3-R0 at 200 LFM airflow ambient = 25.0 # Celsius power = 15.0 # Watts resistance = 1.45 # C/W (approx at 200 LFM) junction_temp = calculate_junction_temp(ambient, power, resistance) print(f"Component Operating Temperature: {junction_temp} C") ```