The **ATS-13E-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of integrated circuits (ICs) and surface-mount components. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-13E-83-C2-R0 | | **Heat Sink Type** | Push-Pin (XC-Cut) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Base Dimensions** | 30.00mm x 30.00mm | | **Height** | 20.00mm | | **Thermal Resistance** | 1.62°C/W (at 200 LFM) | | **Attachment Method** | Push-pin with Brass Spring | --- ## Key Features ### 1. Thermal Efficiency The heat sink features a **cross-cut (XC) pattern**, which provides a high surface area while allowing for multidirectional airflow. This is critical for systems where the direction of the fan exhaust might vary. ### 2. Push-Pin Attachment System The "Push-Pin" mechanism (specifically the brass spring version) ensures: * **Constant Pressure:** Maintains uniform contact between the heat sink and the electronic component (CPU/GPU/FPGA). * **Ease of Assembly:** Quick installation through pre-drilled holes in the PCB without the need for complex tools. ### 3. Material and Coating * **Aluminum Construction:** Offers a balance between lightweight design and high thermal conductivity. * **Blue Anodized Finish:** Increases surface emissivity (improving radiation cooling) and provides protection against corrosion. --- ## Airflow Performance (Thermal Resistance) Airflow is measured in Linear Feet per Minute (LFM). As velocity increases, the thermal resistance decreases, allowing the component to run cooler. | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 2.50 | 1.62 | 1.35 | 1.19 | 1.08 | --- ## Typical Applications This component is commonly used in hardware environments where space is limited but heat generation is high, such as: * **Network Switches and Routers** * **Embedded Systems (SBCs)** * **Industrial Control Units** * **Power Supplies**