The **ATS-13E-99-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management of electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Push-Pin Style) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 11.52°C/W (at 0.5 m/s airflow) | | **Attachment Method** | Push-Pin (with 2-hole mounting) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features #### A. Fin Geometry (Cross-Cut) The "99" series signifies a **cross-cut fin pattern**. Unlike standard straight fins, cross-cut fins allow for multi-directional airflow. This makes it highly efficient in "crowded" PCB environments where airflow might come from multiple angles or be turbulent. #### B. Push-Pin Attachment The model uses a plastic push-pin and spring mechanism: * **Ease of Install:** No tools are required for mounting. * **Constant Pressure:** The spring ensures uniform contact between the heat sink and the heat source, optimizing heat transfer. #### C. Thermal Interface Material (T766) The unit comes with pre-applied **T766 phase-change material**. This eliminates the need for manual application of thermal paste, ensuring a clean and consistent thermal bond. --- ### 3. Electronic Application This part is typically used in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** For industrial PCs and controllers. 3. **Power Electronics:** Managing heat for MOSFET arrays or voltage regulators. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the velocity of airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 4.03 | | **400 (2.0 m/s)** | 2.47 | | **600 (3.0 m/s)** | 1.86 |