The **ATS-13F-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling processors and other electronic components. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-13F-01-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 21.90°C/W (Natural Convection) | | **Base Dimensions** | 40mm x 40mm | | **Height** | 10mm | --- ### 2. Key Component Features #### A. Fin Design: XCUT This model uses a **straight-fin** cross-cut design. This geometry allows for multi-directional airflow, making it effective even in systems where the direction of the cooling fan's exhaust might vary or be turbulent. #### B. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized:** The surface treatment provides corrosion resistance and increased emissivity, which slightly improves radiative heat transfer. #### C. Mounting Mechanism: Push-Pin The "R0" suffix indicates the use of a standard plastic push-pin and spring mounting system. * **Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board). * **Interface:** Provides constant pressure to ensure a tight bond between the heat sink and the component (usually used with Thermal Interface Material/TIM). --- ### 3. Thermal Performance Overview | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | Unducted (Natural) | 21.90 | | 100 LFM | 13.00 | | 300 LFM | 5.50 | | 500 LFM | 3.80 | --- ### 4. Applications This part is commonly used in: * **Network Switches/Routers:** Cooling BGAs and FPGAs. * **Embedded Systems:** For industrial PCs where space is limited (10mm height). * **Power Supplies:** To dissipate heat from voltage regulators.