The **ATS-13F-05-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed for cooling electronic components like CPUs, GPUs, or FPGAs in high-airflow environments. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Brass | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Dimensions** | 40mm x 40mm x 25mm | | **Fin Style** | XCUT (Cross-cut) | --- ### 2. Physical Design & Construction * **XCUT Fin Geometry:** The "XCUT" design features a straight fin pattern that has been cross-cut. This creates a matrix of pins/fins that allows for multidirectional airflow, making it highly efficient in systems where air might not flow in a perfectly straight line. * **Push-Pin Mounting:** This part uses a tool-less attachment system. The push-pins are designed to go through pre-drilled holes in the PCB (Printed Circuit Board). The integrated springs provide constant pressure to ensure optimal contact between the heat sink and the component. * **Blue Anodized Coating:** The blue finish is not just aesthetic; anodizing increases the surface emissivity and protects the aluminum from corrosion. --- ### 3. Thermal Performance The efficiency of this heat sink is measured by its **Thermal Resistance** (°C/W). Lower numbers indicate better cooling performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 12.84 | | **500 (2.5 m/s)** | 4.67 | | **700 (3.5 m/s)** | 3.56 | --- ### 4. Implementation Details The part includes a pre-applied **Thermal Interface Material (T766)**. This is a phase-change or high-conductivity pad located on the base of the heat sink. It eliminates the need for manual application of thermal grease, ensuring a uniform layer that fills microscopic air gaps between the component and the heat sink. ---