The **ATS-13F-08-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It belongs to the "push pin" series, designed for secure attachment to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-13F-08-C3-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 14.32°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Style** | XCUT (Cross-cut) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Components & Design Features #### A. XCUT Fin Geometry The "XCUT" design features fins that are cut both longitudinally and laterally. This creates a matrix of pins/fins that allows for **multi-directional airflow**. This is crucial in dense electronic enclosures where air may not flow in a straight line. #### B. Push-Pin Attachment Instead of using messy thermal adhesives or complex screws, this part uses a spring-loaded push-pin mechanism. * **Ease of Assembly:** Quick installation during the manufacturing process. * **Constant Pressure:** The spring ensures uniform pressure across the component surface, maximizing heat transfer. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T412**, a high-performance thermal tape/pad. This eliminates the need for manual application of thermal grease and ensures a reliable bond between the heat source (CPU, FPGA, or MOSFET) and the aluminum base. --- ### 3. Applications This specific heatsink is typically used for cooling mid-range integrated circuits (ICs) that generate significant heat during operation, such as: * **Telecommunications:** Network switches and routers. * **Computing:** High-speed memory controllers and chipsets. * **Industrial:** Power modules and motor drivers. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 14.32 | | 300 (1.5 m/s) | 4.97 | | 500 (2.5 m/s) | 3.14 |